|
|
| Features |
 |
Micro Via, Buried and Blind Vias |
|
Alternative Surface Finishes(Immersion -TIN, -Silver, -Gold) |
| Applications |
|
Optical Network System |
| Specifications |
|
Layer Count : 12 Layers & H.D.I. |
|
Line / Space : 4.0 / 5.0mil |
|
Material : FR4 |
|
Board Thickness : 95mil |
|
Finish : Immersion Silver |
|
Aspect Ratio 5.4 : 1 |
|
Registration : Max. 5mil |
|
Laser Drill Size : 5mil |
|
Controlled Impedance : 50 Ω, 95 Ω, 100 Ω (±10%) |
|
|
| HDI PCB |
--> |
2005 |
2006 |
| Material |
RCC, FR-4 |
RCC, FR-4 |
RCC, FR-4 |
| Laser Via(㎛) |
4mil (100㎛) |
3mil (75㎛) |
2mil (50㎛) |
| Aspect Ratio (Via) |
1 : 0.8 |
1 : 1.6 |
1 : 2.4 |
| Via Hole |
BVH
Blind |
Stacked
Staggered
Via Filling |
NMBI-Phase |
|
